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Product Comparison

A single table covering the differences between the C1901 / C1902 / C1903 / C2401 and the official Developer Kit, so you can pick the right board quickly.

Module Specifications (Official NVIDIA Data)

All four carrier boards support the four Orin modules below; compute performance depends on the module you choose:

SpecOrin Nano 4GBOrin Nano 8GBOrin NX 8GBOrin NX 16GB
AI performance20 TOPS40 TOPS70 TOPS100 TOPS
SUPER mode34 TOPS67 TOPS117 TOPS157 TOPS
GPU512 CUDA + 16 Tensor1024 CUDA + 32 Tensor1024 CUDA + 32 Tensor1024 CUDA + 32 Tensor
CPU6-core A78AE @1.5GHz6-core A78AE @1.5GHz8-core A78AE @2GHz8-core A78AE @2GHz
Memory4GB 64-bit LPDDR58GB 128-bit LPDDR58GB 128-bit LPDDR516GB 128-bit LPDDR5
Memory bandwidth34 GB/s68 GB/s102.4 GB/s102.4 GB/s
Power7-15W7-15W10-25W10-25W
Video decode1x 4K60 / 5x 1080p60 (H.265)SameUp to 12x 1080p30Up to 12x 1080p60

SUPER mode is supported on JetPack 5.1.5 and JetPack 6.1 or later; use SUPER firmware that matches the module and carrier board.

Main Comparison Table

SpecOfficial DevKitC1901C1902C1903C2401
Supported modulesOrin Nano / NXOrin Nano 4GB/8GB, Orin NX 8GB/16GBSameSameSame
PositioningReference designCost-optimizedFully compatibleIndustrial-grade carrier board / kitHigh-density mini kit
Power input19V / DC552512V (9-19V) / DC552112V (9-19V) / DC552512V (9.5-19V) / DC552512V (9.5-30V) / XT30
Ethernet1x GbE1x GbE1x GbE1x GbE1x GbE + 1x 2.5G (PTP, 16KB jumbo frames)
USB4x USB 3.0 + Type-C (3.0)3x USB 3.0 + 1x USB 2.0, Type-C 2.0 (flashing only)4x USB 3.2 (10Gbps) + Type-C 3.04x USB 3.0 (5Gbps) + 1x USB 3.0 (10Gbps), Type-C 2.0 (flashing only)2x USB 3.2 (10Gbps) + 1x USB 2.0, Type-C 2.0 (flashing only)
M.2 storage2x Key M2x Key M (2280 + 2230)2x Key M (2280 4-lane + 2230 2-lane)2x Key M (2280 + 2230)1x Key M (2230, same-side layout)
M.2 wireless1x Key E1x Key E1x Key E1x Key E (2230)1x Key E (2230)
Camera2x CSI-22x CSI-2 22P2x CSI-2 22P2x CSI-2 22P1x CSI-2 22P
Display1x DP 1.21x HDMI (1080P, DP-converted)1x DP 1.21x HDMI 2.11x Mini HDMI 2.1
CANYes (unpopulated)YesYes (unpopulated)Yes (GH1.25-2P)Yes (GH1.25-2P)
GPIO / expansion40-pin40-pin + 12-pin debug40-pin + 12-pin debugGH1.25 (UART / I2C / SPI / GPIO)30-pin expansion header (UART / I2C / CAN)
RTC batteryNoYesYesYesYes
PoEYes (unpopulated)NoNoNoNo
SUPER modeOrin Nano onlyOrin Nano onlyAll modules (Nano + NX)All modules (Nano + NX)Orin Nano only
DimensionsReference sizeSimilar to referenceSimilar to reference55 x 92 mm carrier board55 x 92 mm (8-layer PCB)
Operating temp.0~45℃0~45℃0~45℃-20~50℃0~45℃
Power protectionBasicReverse-polarity protectionReverse-polarity protectionReverse-polarity protectionAutomotive-grade E-fuse (OVP/UVP/SCP/OCP/reverse)
Best forEvaluationCost-sensitive vision/AI productionFull DevKit compatibility + SUPER performanceIndustrial integration requiring dual M.2 and expanded interfacesSpace-constrained embedded / robotics / mobile

Selection Guidance

PrioritySuggested platformSelection notes
Reduce system cost with GbE, USB, dual M.2, and a 40-pin header as the main interface requirementsC1901Omits some reference-board interfaces; confirm the PCB revision, module, and matching device tree before deployment.
Reuse the official Developer Kit firmware and interface layout, or enable SUPER mode on Orin NXC1902Its interface configuration follows the NVIDIA reference carrier and supports the corresponding official firmware; its footprint remains in the reference-board class.
Require industrial-grade component selection, dual M.2, expanded USB/GH1.25 interfaces, and SUPER mode across Orin Nano/NXC1903Uses 9.5–19V DC5525 input and provides UART, I2C, SPI, and GPIO peripheral connectors.
Minimize board area or require dual Ethernet, 2.5GbE, 9.5–30V input, and a compact layoutC2401The 55 × 92 mm board uses XT30 power and a 30-pin expansion connector; it does not use the standard 40-pin layout, so verify the pinout before integrating peripherals.
Establish a software and hardware baseline against NVIDIA documentationOfficial Developer KitThe official reference platform is appropriate for compatibility baselines; product integration still requires a separate review of size, power, interfaces, and production constraints.

The final choice should also account for module SKU, JetPack release, camera count, storage, thermal design, and available enclosure space.

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